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FT602Q-TFTDI, Future Technology Devices International Ltd IC USB3-32BIT SYNC FIFO 76QFN
Part NumberFT602Q-T
Package76-VFQFN Exposed Pad
ManufacturerFTDI, Future Technology Devices International Ltd
RoHs Status
Manufacturer Part NumberFTDI, Future Technology Devices International Ltd-FT602Q-T
DescriptionIC USB3-32BIT SYNC FIFO 76QFN
In stock4218
Data sheet
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  • Specifications
  • Product Details - FT602Q-T
  • FT602Q-T Tech Specifications
    FTDI, Future Technology Devices International Ltd - FT602Q-T technical specifications, attributes, parameters and parts with similar specifications to FTDI, Future Technology Devices International Ltd - FT602Q-T
    Manufacturer FTDI, Future Technology Devices International Ltd
    Voltage - Supply 1.8V, 2.5V, 3.3V
    Supplier Device Package 76-QFN (9x9)
    Standards USB 3.0
    Series -
    Protocol USB
    Package / Case 76-VFQFN Exposed Pad
    Package Tray
    Operating Temperature -40°C ~ 85°C
    Interface USB
    Function Bridge, USB to FIFO
    Current - Supply -
  • TheFT602Q-Tis a Integrated Circuits (ICs) component, full developed and mass-produced by FTDI, Future Technology Devices International Ltd manufacturer, subject to rigorous quality control and successfully meeting production standards. The product description is IC USB3-32BIT SYNC FIFO 76QFN and it falls under the category of Interface - Controllers, with Manufacturer of FTDI, Future Technology Devices International Ltd and Voltage - Supply of 1.8V, 2.5V, 3.3V and Supplier Device Package of 76-QFN (9x9). Efficient purchasing through Ftdi-Chip.com. Here, you can find a wide variety of electronic components produced by manufacturers worldwide. If you do not find the information you are looking for, you can obtain more valuable information via email [email protected], such as stock quantities, special pricing, datasheets, and more details for FT602Q-T or order. We are always pleased to hear from you, so feel free to contact us at any time.

Product Comparison

Product Attribute FT602Q-T FT4232H-56Q MINI MDL FT221XS-R FT601Q-B-R
Part Number FT602Q-T FT4232H-56Q MINI MDL FT221XS-R FT601Q-B-R
Manufacturer FTDI, Future Technology Devices International Ltd FTDI, Future Technology Devices International Ltd FTDI, Future Technology Devices International Ltd FTDI, Future Technology Devices International Ltd
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C (TA)
Voltage - Supply 1.8V, 2.5V, 3.3V 3.3V 3.3V ~ 5V 1.65V ~ 1.95V, 2.3V ~ 2.7V, 3V ~ 3.6V
Supplier Device Package 76-QFN (9x9) Module 20-SSOP 76-QFN (9x9)
Series - - USBmadeEZ-FIFO, FT-X, X-Chip -
Current - Supply - - 11mA 185mA
Function Bridge, USB to FIFO Bridge, USB to UART,FIFO Bridge, USB to SPI Bridge, USB to FIFO
Package Tray Bulk Tape & Reel (TR) Tape & Reel (TR)
Standards USB 3.0 USB 2.0 USB 2.0 USB 3.0
Protocol USB USB USB USB
Interface USB FIFO SPI FIFO, USB
Package / Case 76-VFQFN Exposed Pad Module 20-SSOP (0.154', 3.90mm Width) 76-VFQFN Exposed Pad
Payment Support The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
Certifications & Memberships We strictly controls the quality of products, environment and services.Through the ISO certification of the third party. View More >

Brand introduction

FTDI, Future Technology Devices International Ltd FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. Through application of its “Design Made Easy” ethos, the company is able to support engineers with highly sophisticated, feature-rich, robust and sim...
- FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. Through application of its “Design Made Easy” ethos, the company is able to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms.
FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts universally recognized products. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip allowing dramatic reductions in the development time and bill-of-materials costs involved in Human Machine Interfaces (HMIs) implementation. FTDI Chip also provides families of highly differentiated, speed-optimised microcontrollers with augmented connectivity.
FTDI Chip is a fab-less semiconductor company headquartered in Glasgow, UK, with research and development facilities located in Glasgow, Singapore and Taipei (Taiwan), plus regional sales and technical support sites in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China). For more information go to www.ftdichip.com.
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