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FT601Q-TFTDI, Future Technology Devices International Ltd IC USB3-32BIT SYNC FIFO 76QFN
Part NumberFT601Q-T
Package76-VFQFN Exposed Pad
ManufacturerFTDI, Future Technology Devices International Ltd
RoHs Status
Manufacturer Part NumberFTDI, Future Technology Devices International Ltd-FT601Q-T
DescriptionIC USB3-32BIT SYNC FIFO 76QFN
In stock3922
Data sheet
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  • Specifications
  • Product Details - FT601Q-T
  • FT601Q-T Tech Specifications
    FTDI, Future Technology Devices International Ltd - FT601Q-T technical specifications, attributes, parameters and parts with similar specifications to FTDI, Future Technology Devices International Ltd - FT601Q-T
    Manufacturer FTDI, Future Technology Devices International Ltd
    Voltage - Supply 1.65V ~ 3.6V
    Supplier Device Package 76-QFN (9x9)
    Standards USB 3.0
    Series FT60x
    Protocol USB
    Package / Case 76-VFQFN Exposed Pad
    Package Tray
    Operating Temperature -40°C ~ 85°C
    Interface FIFO
    Function Bridge, USB to FIFO
    Current - Supply -
  • TheFT601Q-Tis a Integrated Circuits (ICs) component, full developed and mass-produced by FTDI, Future Technology Devices International Ltd manufacturer, subject to rigorous quality control and successfully meeting production standards. The product description is IC USB3-32BIT SYNC FIFO 76QFN and it falls under the category of Interface - Controllers, with Manufacturer of FTDI, Future Technology Devices International Ltd and Voltage - Supply of 1.65V ~ 3.6V and Supplier Device Package of 76-QFN (9x9). Efficient purchasing through Ftdi-Chip.com. Here, you can find a wide variety of electronic components produced by manufacturers worldwide. If you do not find the information you are looking for, you can obtain more valuable information via email [email protected], such as stock quantities, special pricing, datasheets, and more details for FT601Q-T or order. We are always pleased to hear from you, so feel free to contact us at any time.

Product Comparison

Product Attribute FT601Q-T FT2232HPQ-TRAY FT232RQ-TRAY FT230XQ-R
Part Number FT601Q-T FT2232HPQ-TRAY FT232RQ-TRAY FT230XQ-R
Manufacturer FTDI, Future Technology Devices International Ltd FTDI, Future Technology Devices International Ltd FTDI, Future Technology Devices International Ltd FTDI, Future Technology Devices International Ltd
Voltage - Supply 1.65V ~ 3.6V 1.62V ~ 1.98V, 2.97V ~ 3.63V 3.3V ~ 5.25V 3.3V ~ 5V
Current - Supply - 70mA 15mA 8mA
Package / Case 76-VFQFN Exposed Pad 68-VFQFN Exposed Pad 32-VFQFN Exposed Pad 16-WQFN Exposed Pad
Supplier Device Package 76-QFN (9x9) 68-QFN (8x8) 32-QFN (5x5) 16-QFN (4x4)
Protocol USB USB USB USB
Function Bridge, USB to FIFO Bridge, USB to UART,FIFO Bridge, USB to UART Bridge, USB to UART
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C (TA) -40°C ~ 85°C -40°C ~ 85°C
Package Tray Tray Tray Tape & Reel (TR)
Standards USB 3.0 USB 2.0 USB 2.0 USB 2.0
Series FT60x - USBmadeEZ-UART USBmadeEZ-UART, FT-X, X-Chip
Interface FIFO I²C, FIFO, JTAG, Serial, SPI, UART UART UART
Payment Support The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
Certifications & Memberships We strictly controls the quality of products, environment and services.Through the ISO certification of the third party. View More >

Brand introduction

FTDI, Future Technology Devices International Ltd FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. Through application of its “Design Made Easy” ethos, the company is able to support engineers with highly sophisticated, feature-rich, robust and sim...
- FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. Through application of its “Design Made Easy” ethos, the company is able to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms.
FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts universally recognized products. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip allowing dramatic reductions in the development time and bill-of-materials costs involved in Human Machine Interfaces (HMIs) implementation. FTDI Chip also provides families of highly differentiated, speed-optimised microcontrollers with augmented connectivity.
FTDI Chip is a fab-less semiconductor company headquartered in Glasgow, UK, with research and development facilities located in Glasgow, Singapore and Taipei (Taiwan), plus regional sales and technical support sites in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China). For more information go to www.ftdichip.com.
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