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FTDI, Future Technology Devices International Ltd
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UMFT602A-BFTDI, Future Technology Devices International Ltd DEV FT602 USB3 UVC 32BIT HSMC
Part NumberUMFT602A-B
Package
ManufacturerFTDI (Future Technology Devices International, Ltd.)
RoHs Status
Manufacturer Part NumberFTDI, Future Technology Devices International Ltd-UMFT602A-B
DescriptionDEV FT602 USB3 UVC 32BIT HSMC
In stock293
Data sheet
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  • Specifications
  • Product Details - UMFT602A-B
  • UMFT602A-B Tech Specifications
    FTDI, Future Technology Devices International Ltd - UMFT602A-B technical specifications, attributes, parameters and parts with similar specifications to FTDI, Future Technology Devices International Ltd - UMFT602A-B
    Manufacturer FTDI (Future Technology Devices International, Ltd.)
    Utilized IC / Part FT602
    Type Interface
    Supplied Contents Board(s)
    Series -
    Secondary Attributes -
    Primary Attributes -
    Package Bulk
    Function USB 3.0 to Parallel FIFO Bridge
    Embedded -
    Base Product Number UMFT602
  • TheUMFT602A-Bis a Development Boards, Kits, Programmers component, full developed and mass-produced by FTDI, Future Technology Devices International Ltd manufacturer, subject to rigorous quality control and successfully meeting production standards. The product description is DEV FT602 USB3 UVC 32BIT HSMC and it falls under the category of Evaluation and Demonstration Boards and Kits, with Manufacturer of FTDI (Future Technology Devices International, Ltd.) and Utilized IC / Part of FT602 and Type of Interface. Efficient purchasing through Ftdi-Chip.com. Here, you can find a wide variety of electronic components produced by manufacturers worldwide. If you do not find the information you are looking for, you can obtain more valuable information via email [email protected], such as stock quantities, special pricing, datasheets, and more details for UMFT602A-B or order. We are always pleased to hear from you, so feel free to contact us at any time.

Product Comparison

Product Attribute UMFT602A-B UMFT4233HPEV UMFT4222EV-C UMFT600X
Part Number UMFT602A-B UMFT4233HPEV UMFT4222EV-C UMFT600X
Manufacturer FTDI, Future Technology Devices International Ltd FTDI, Future Technology Devices International Ltd FTDI, Future Technology Devices International Ltd FTDI, Future Technology Devices International Ltd
Series - - - -
Embedded - No - -
Package Bulk Box Bulk Box
Base Product Number UMFT602 - - -
Type Interface Interface Interface Interface
Supplied Contents Board(s) Board(s) Board(s) Board(s)
Secondary Attributes - On-Board LEDs, Test Points - On-Board LEDs
Primary Attributes - 3.3V, 3.46V Supply - -
Utilized IC / Part FT602 FT4233HP FT4222H FT600
Function USB 3.0 to Parallel FIFO Bridge USB Type-C® USB 2.0 to I²C/SPI Bridge USB 3.0 to Parallel FIFO Bridge
Payment Support The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
Certifications & Memberships We strictly controls the quality of products, environment and services.Through the ISO certification of the third party. View More >

Brand introduction

FTDI, Future Technology Devices International Ltd FTDI, Future Technology Devices International Ltd FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. Through application of its “Design Made Easy” ethos, the company is able to support engineers with highly sophisticated, feature-rich, robust and sim...
- FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. Through application of its “Design Made Easy” ethos, the company is able to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms.
FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts universally recognized products. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip allowing dramatic reductions in the development time and bill-of-materials costs involved in Human Machine Interfaces (HMIs) implementation. FTDI Chip also provides families of highly differentiated, speed-optimised microcontrollers with augmented connectivity.
FTDI Chip is a fab-less semiconductor company headquartered in Glasgow, UK, with research and development facilities located in Glasgow, Singapore and Taipei (Taiwan), plus regional sales and technical support sites in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China). For more information go to www.ftdichip.com.
FTDI (Future Technology Devices International, Ltd.)
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